Molex MicroClasp Series Right Angle Through Hole PCB Header, 3 Contact(s), 2.0mm Pitch, 1 Row(s), Shrouded
Technical Document
Specifications
Brand
MolexSeries
MICROCLASP
Pitch
2.0mm
Number Of Contacts
3
Number Of Rows
1
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Through Hole
Termination Method
Solder
Contact Plating
Tin
Series Number
55935
Current Rating
3.0A
Voltage Rating
250.0 V
Country of Origin
Japan
Product details
Single Row Right Angle Header with Boss
Approvals
UL 94V-0
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.
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€ 126.00
€ 0.63 Each (Supplied in a Bag) (Exc. VAT)
€ 148.68
€ 0.743 Each (Supplied in a Bag) (inc. VAT)
Production pack (Bag)
200
€ 126.00
€ 0.63 Each (Supplied in a Bag) (Exc. VAT)
€ 148.68
€ 0.743 Each (Supplied in a Bag) (inc. VAT)
Stock information temporarily unavailable.
Production pack (Bag)
200
Stock information temporarily unavailable.
| Quantity | Unit price | Per Bag |
|---|---|---|
| 200 - 740 | € 0.63 | € 6.30 |
| 750 - 2990 | € 0.60 | € 6.00 |
| 3000 - 5990 | € 0.60 | € 6.00 |
| 6000+ | € 0.60 | € 6.00 |
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products
Technical Document
Specifications
Brand
MolexSeries
MICROCLASP
Pitch
2.0mm
Number Of Contacts
3
Number Of Rows
1
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Through Hole
Termination Method
Solder
Contact Plating
Tin
Series Number
55935
Current Rating
3.0A
Voltage Rating
250.0 V
Country of Origin
Japan
Product details
Single Row Right Angle Header with Boss
Approvals
UL 94V-0
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products