Atmel AT91SAM9263B-CU-100, 32bit ARM Microcontroller, AT91, 200MHz, 128 kB ROM, 324-Pin TFBGA
Technical Document
Specifications
Number of I2C Channels
0
Number of PCI Channels
0
Number of LIN Channels
0
Number of CAN Channels
1
Number of UART Channels
1
Maximum Number of Ethernet Channels
1
Number of Ethernet Channels
1
Number of PWM Units
1
USB Channels
1
Number of SPI Channels
2
Number of USART Channels
2
Data Bus Width
32bit
Device Core
ARM
Minimum Operating Temperature
-40 °C
Program Memory Type
ROM
Maximum Operating Temperature
+85 °C
Instruction Set Architecture
RISC
Mounting Type
Surface Mount
Maximum Frequency
200MHz
Program Memory Size
128 kB
Height
0.79mm
Pin Count
324
Typical Operating Supply Voltage
1.8 V, 2.5 V, 3 V, 3.3 V
Brand
AtmelRAM Size
16 kB, 80 kB
Family Name
AT91
Pulse Width Modulation
1 (4 x 16 bit)
Length
15mm
Width
15mm
Package Type
TFBGA
Dimensions
15 x 15 x 0.79mm
Product details
HF32 Soldering Wire, Sn60Pb39Cu1
Sn60Pb39Cu1 alloy with flux core
Reduced wear of soldering iron tips, thus more productive soldering of copper wires
Solidus at 183 °C, liquidus at 215 °C
Flux content of 3.5%
Standards
EN ISO 9453:2006
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P.O.A.
Standard
1
P.O.A.
Standard
1
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Technical Document
Specifications
Number of I2C Channels
0
Number of PCI Channels
0
Number of LIN Channels
0
Number of CAN Channels
1
Number of UART Channels
1
Maximum Number of Ethernet Channels
1
Number of Ethernet Channels
1
Number of PWM Units
1
USB Channels
1
Number of SPI Channels
2
Number of USART Channels
2
Data Bus Width
32bit
Device Core
ARM
Minimum Operating Temperature
-40 °C
Program Memory Type
ROM
Maximum Operating Temperature
+85 °C
Instruction Set Architecture
RISC
Mounting Type
Surface Mount
Maximum Frequency
200MHz
Program Memory Size
128 kB
Height
0.79mm
Pin Count
324
Typical Operating Supply Voltage
1.8 V, 2.5 V, 3 V, 3.3 V
Brand
AtmelRAM Size
16 kB, 80 kB
Family Name
AT91
Pulse Width Modulation
1 (4 x 16 bit)
Length
15mm
Width
15mm
Package Type
TFBGA
Dimensions
15 x 15 x 0.79mm
Product details
HF32 Soldering Wire, Sn60Pb39Cu1
Sn60Pb39Cu1 alloy with flux core
Reduced wear of soldering iron tips, thus more productive soldering of copper wires
Solidus at 183 °C, liquidus at 215 °C
Flux content of 3.5%
Standards
EN ISO 9453:2006
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products