Amphenol ICC TMM Series Straight Through Hole PCB Header, 20 Contact(s), 2.54mm Pitch, 2 Row(s), Shrouded

RS Stock No.: 739-1126PBrand: Amphenol ICCManufacturers Part No.: TMM-3-0-20-1
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Technical Document

Specifications

Series

TMM

Pitch

2.54mm

Number Of Contacts

20

Number Of Rows

2

Body Orientation

Straight

Shrouded/Unshrouded

Shrouded

Mounting Type

Through Hole

Connector System

Board to Board

Termination Method

Solder

Contact Material

Phosphor Bronze

Contact Plating

Tin

Current Rating

1.0A

Voltage Rating

30.0 V

Country of Origin

China

Product details

DIP Male Headers

These Amphenol DIP TMM MicroMatch 1.27 mm pitch range of male Headers are for Board to Board connections. When mated with the appropriate TMM MicroMatch female Header (see stock number 739-1136 typical) they provide a Board to Board spacing of 7.1mm. The design of these TMM MicroMatch male Headers provides improved retention by including a friction lock which is utilised when mated to the appropriate Locking female Header (see stock number 739-1259 typical, with Lock).

1.27mm IDC - Amphenol TMM Range

A range of Amphenol TMM MicroMatch 1.27 mm pitch (staggered contact spacing) Board to Board or Wire to Board connectors rated at 1.5 A, 230 Vac RMS 60 Hz, DC. These TMM MicroMatch connectors are available in even number of positions from 4 to 26. All the TMM MicroMatch contacts are fully tinned with the PCB tails also being kinked to improve header retention during soldering operations. Locking latches are available on the female TMM MicroMatch connectors and the male connectors have a polarization guide to ensure correct orientation.

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P.O.A.

Amphenol ICC TMM Series Straight Through Hole PCB Header, 20 Contact(s), 2.54mm Pitch, 2 Row(s), Shrouded
Select packaging type

P.O.A.

Amphenol ICC TMM Series Straight Through Hole PCB Header, 20 Contact(s), 2.54mm Pitch, 2 Row(s), Shrouded
Stock information temporarily unavailable.
Select packaging type

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more

Technical Document

Specifications

Series

TMM

Pitch

2.54mm

Number Of Contacts

20

Number Of Rows

2

Body Orientation

Straight

Shrouded/Unshrouded

Shrouded

Mounting Type

Through Hole

Connector System

Board to Board

Termination Method

Solder

Contact Material

Phosphor Bronze

Contact Plating

Tin

Current Rating

1.0A

Voltage Rating

30.0 V

Country of Origin

China

Product details

DIP Male Headers

These Amphenol DIP TMM MicroMatch 1.27 mm pitch range of male Headers are for Board to Board connections. When mated with the appropriate TMM MicroMatch female Header (see stock number 739-1136 typical) they provide a Board to Board spacing of 7.1mm. The design of these TMM MicroMatch male Headers provides improved retention by including a friction lock which is utilised when mated to the appropriate Locking female Header (see stock number 739-1259 typical, with Lock).

1.27mm IDC - Amphenol TMM Range

A range of Amphenol TMM MicroMatch 1.27 mm pitch (staggered contact spacing) Board to Board or Wire to Board connectors rated at 1.5 A, 230 Vac RMS 60 Hz, DC. These TMM MicroMatch connectors are available in even number of positions from 4 to 26. All the TMM MicroMatch contacts are fully tinned with the PCB tails also being kinked to improve header retention during soldering operations. Locking latches are available on the female TMM MicroMatch connectors and the male connectors have a polarization guide to ensure correct orientation.

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more