Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid
€ 80.01
€ 80.01 Each (Exc. VAT)
€ 94.41
€ 94.41 Each (inc. VAT)
1
€ 80.01
€ 80.01 Each (Exc. VAT)
€ 94.41
€ 94.41 Each (inc. VAT)
Stock information temporarily unavailable.
1
Stock information temporarily unavailable.
| Quantity | Unit price |
|---|---|
| 1 - 9 | € 80.01 |
| 10 - 19 | € 77.99 |
| 20 - 49 | € 76.70 |
| 50+ | € 71.15 |
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
