Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid
€ 48.86
€ 48.86 Each (Exc. VAT)
€ 57.65
€ 57.65 Each (inc. VAT)
1
€ 48.86
€ 48.86 Each (Exc. VAT)
€ 57.65
€ 57.65 Each (inc. VAT)
Stock information temporarily unavailable.
1
Stock information temporarily unavailable.
| Quantity | Unit price |
|---|---|
| 1 - 4 | € 48.86 |
| 5 - 9 | € 47.63 |
| 10 - 39 | € 45.84 |
| 40+ | € 42.43 |
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
