Technical Document
Specifications
Brand
HiroseNumber of Contacts
30
Product Type
PCB Socket
Number of Rows
2
Current
300mA
Pitch
0.5mm
Housing Material
Liquid Crystal Polymer
Termination Type
Solder
Mount Type
Surface
Orientation
Straight
Connector System
Board-to-Board, Board-to-FPC
Stacking Height
1.5mm
Series
DF23
Row Pitch
4.4mm
Minimum Operating Temperature
-35°C
Contact Plating
Gold
Contact Gender
Female
Maximum Operating Temperature
85°C
Contact Material
Copper
Standards/Approvals
No
Country of Origin
Japan
Product details
Hirose DF23 series
Hirose DF23 series 0.5mm Pitch Low-Profile Board-to-Board / Board-to-FPC Connectors
Features and Benefits
• 1.5 mm board-to-board distance
• Click sensation
• High contact reliability
• Large self-alignment
• Board placement with automatic equipment
Stock information temporarily unavailable.
€ 14.80
€ 1.48 Each (In a Pack of 10) (Exc. VAT)
€ 17.46
€ 1.746 Each (In a Pack of 10) (inc. VAT)
Standard
10
€ 14.80
€ 1.48 Each (In a Pack of 10) (Exc. VAT)
€ 17.46
€ 1.746 Each (In a Pack of 10) (inc. VAT)
Stock information temporarily unavailable.
Standard
10
| Quantity | Unit price | Per Pack |
|---|---|---|
| 10 - 190 | € 1.48 | € 14.80 |
| 200 - 740 | € 1.39 | € 13.90 |
| 750 - 2990 | € 1.17 | € 11.70 |
| 3000+ | € 0.95 | € 9.50 |
Technical Document
Specifications
Brand
HiroseNumber of Contacts
30
Product Type
PCB Socket
Number of Rows
2
Current
300mA
Pitch
0.5mm
Housing Material
Liquid Crystal Polymer
Termination Type
Solder
Mount Type
Surface
Orientation
Straight
Connector System
Board-to-Board, Board-to-FPC
Stacking Height
1.5mm
Series
DF23
Row Pitch
4.4mm
Minimum Operating Temperature
-35°C
Contact Plating
Gold
Contact Gender
Female
Maximum Operating Temperature
85°C
Contact Material
Copper
Standards/Approvals
No
Country of Origin
Japan
Product details
Hirose DF23 series
Hirose DF23 series 0.5mm Pitch Low-Profile Board-to-Board / Board-to-FPC Connectors
Features and Benefits
• 1.5 mm board-to-board distance
• Click sensation
• High contact reliability
• Large self-alignment
• Board placement with automatic equipment


