Technical Document
Specifications
Channel Type
N
Maximum Continuous Drain Current
1.2 A
Maximum Drain Source Voltage
30 V
Package Type
SOT-23
Mounting Type
Surface Mount
Pin Count
3
Maximum Drain Source Resistance
400 mΩ
Channel Mode
Enhancement
Maximum Power Dissipation
540 mW
Maximum Gate Source Voltage
-20 V, +20 V
Typical Gate Charge @ Vgs
3.3 nC @ 10 V
Number of Elements per Chip
1
Maximum Operating Temperature
+150 °C
Length
3.04mm
Width
1.4mm
Series
HEXFET
Minimum Operating Temperature
-55 °C
Height
1.02mm
P.O.A.
Each (In a Pack of 5) (Exc. VAT)
5
P.O.A.
Each (In a Pack of 5) (Exc. VAT)
5
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Technical Document
Specifications
Channel Type
N
Maximum Continuous Drain Current
1.2 A
Maximum Drain Source Voltage
30 V
Package Type
SOT-23
Mounting Type
Surface Mount
Pin Count
3
Maximum Drain Source Resistance
400 mΩ
Channel Mode
Enhancement
Maximum Power Dissipation
540 mW
Maximum Gate Source Voltage
-20 V, +20 V
Typical Gate Charge @ Vgs
3.3 nC @ 10 V
Number of Elements per Chip
1
Maximum Operating Temperature
+150 °C
Length
3.04mm
Width
1.4mm
Series
HEXFET
Minimum Operating Temperature
-55 °C
Height
1.02mm