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RS PRO Liquid Adhesive, 10 ml

RS Stock No.: 567-581Brand: RS PRO
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Technical Document

Specifications

Brand

RS Pro

Adhesive Type

Acrylic Adhesive

Application

Sealing

Material Compatibility

Metal, Plastic

Colour

Red

Product Form

Liquid

Package Type

Syringe

Package Size

10 ml

Cure Time

1 h

Viscosity Measurement

1450mPa/s

Special Features

Solvent Resistant

Maximum Operating Temperature

+140°C

Specific Gravity

1.16

Chemical Composition

Aliphatic Amines, Epoxy Resin, Neopentyl Glycol Diglycidyl Ether

Country of Origin

United Kingdom

Product details

RS Pro Heat Cured SMT Adhesive

Our RS Pro range of heat cured SMT Adhesive is a one part thixotropic paste adhesive that will provide a great bond for the protection of electronic components by either dipping or “glob topping. It packs a punch in great “green strength” or stickiness to ensure that the components do not move during handling. With the adhesive being supplied in a syringe, it makes for effortless mounting.

We recommend using a dispenser needle with this product. See below for compatible needles.

Features and benefits –

• High “green strength” (stickiness) for easy mounting.
• Resistant to PCB cleaning solvents to ensure components stay in place.
• Excellent electrical characteristics
• Long term stability after cure cycle
• Flexible in a cured state to ensure components are not stressed.
• Medium strength to allow for easy components removal for reworking.
• Thixotropic properties give a high dot profile.
• Working temperature after curing of -40°C to +130°C
• Non toxic
• 1% water absorption rate after 3 hours in boiling water so rest assure all moisture sensitive devices will be safe.

Looking for a dispenser needle?

General purpose dispenser – 669-3869
For a more precise dispenser needle – 505-7786

FAQ (Frequently Asked Questions)

Will this adhesive keep moisture away from my sensitive components?
Yes. This product is designed to be “glob topped” onto your PCB to protect your valuable components.

How fast will it cure?
This depends on the temperature you cure it at. The higher the temperature the faster it cures. We recommend the highest temperature you cure at is 120°C. At 120°C it will cure in 20 minutes.

RS PRO

RS PRO is our own brand range and brings you a wide range of high-quality, great value products offering you more choice. Trusted by engineers all over the world, every part of every RS PRO product has been rigorously tested against demanding industry standards; they’re only given the RS PRO Seal of Approval if we’re confident of their exceptional quality, which means you can be confident too.

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P.O.A.

RS PRO Liquid Adhesive, 10 ml

P.O.A.

RS PRO Liquid Adhesive, 10 ml
Stock information temporarily unavailable.

Technical Document

Specifications

Brand

RS Pro

Adhesive Type

Acrylic Adhesive

Application

Sealing

Material Compatibility

Metal, Plastic

Colour

Red

Product Form

Liquid

Package Type

Syringe

Package Size

10 ml

Cure Time

1 h

Viscosity Measurement

1450mPa/s

Special Features

Solvent Resistant

Maximum Operating Temperature

+140°C

Specific Gravity

1.16

Chemical Composition

Aliphatic Amines, Epoxy Resin, Neopentyl Glycol Diglycidyl Ether

Country of Origin

United Kingdom

Product details

RS Pro Heat Cured SMT Adhesive

Our RS Pro range of heat cured SMT Adhesive is a one part thixotropic paste adhesive that will provide a great bond for the protection of electronic components by either dipping or “glob topping. It packs a punch in great “green strength” or stickiness to ensure that the components do not move during handling. With the adhesive being supplied in a syringe, it makes for effortless mounting.

We recommend using a dispenser needle with this product. See below for compatible needles.

Features and benefits –

• High “green strength” (stickiness) for easy mounting.
• Resistant to PCB cleaning solvents to ensure components stay in place.
• Excellent electrical characteristics
• Long term stability after cure cycle
• Flexible in a cured state to ensure components are not stressed.
• Medium strength to allow for easy components removal for reworking.
• Thixotropic properties give a high dot profile.
• Working temperature after curing of -40°C to +130°C
• Non toxic
• 1% water absorption rate after 3 hours in boiling water so rest assure all moisture sensitive devices will be safe.

Looking for a dispenser needle?

General purpose dispenser – 669-3869
For a more precise dispenser needle – 505-7786

FAQ (Frequently Asked Questions)

Will this adhesive keep moisture away from my sensitive components?
Yes. This product is designed to be “glob topped” onto your PCB to protect your valuable components.

How fast will it cure?
This depends on the temperature you cure it at. The higher the temperature the faster it cures. We recommend the highest temperature you cure at is 120°C. At 120°C it will cure in 20 minutes.

RS PRO

RS PRO is our own brand range and brings you a wide range of high-quality, great value products offering you more choice. Trusted by engineers all over the world, every part of every RS PRO product has been rigorously tested against demanding industry standards; they’re only given the RS PRO Seal of Approval if we’re confident of their exceptional quality, which means you can be confident too.