Technical Document
Specifications
Brand
Syfer TechnologyCapacitance
1nF
Voltage
50V dc
Package/Case
1206 (3216M)
Mounting Type
Surface Mount
Dielectric
X7R
Tolerance
±5%
Dimensions
3.2 x 1.6 x 1.6mm
Length
3.2mm
Depth
1.6mm
Height
1.6mm
Series
Flexicap
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Terminal Type
Surface Mount
Country of Origin
United Kingdom
Product details
Syfer Flexicap 1206
FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs
A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish
FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors
An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking
FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
1206 Range
P.O.A.
Each (On a Reel of 2500) (Exc. VAT)
2500
P.O.A.
Each (On a Reel of 2500) (Exc. VAT)
2500
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Technical Document
Specifications
Brand
Syfer TechnologyCapacitance
1nF
Voltage
50V dc
Package/Case
1206 (3216M)
Mounting Type
Surface Mount
Dielectric
X7R
Tolerance
±5%
Dimensions
3.2 x 1.6 x 1.6mm
Length
3.2mm
Depth
1.6mm
Height
1.6mm
Series
Flexicap
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Terminal Type
Surface Mount
Country of Origin
United Kingdom
Product details
Syfer Flexicap 1206
FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs
A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish
FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors
An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking
FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes