TE Connectivity Z-PACK HM Series Straight Through Hole Mount PCB Socket, 3-Contact, Solder Termination

RS Stock No.: 165-0967Brand: TE ConnectivityManufacturers Part No.: 5-5223955-2
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Technical Document

Specifications

Brand

TE Connectivity

Number Of Contacts

3

Type

Board to Board

Mounting Type

Through Hole

Body Orientation

Straight

Termination Method

Solder

Current Rating

1.15A

Voltage Rating

250 V

Series

Z-PACK HM

Contact Material

Copper

Country of Origin

China

Product details

Z-PACK™ HS3 Connectors

The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.

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€ 489.60

€ 8.16 Each (In a Tube of 60) (Exc. VAT)

€ 577.73

€ 9.629 Each (In a Tube of 60) (inc. VAT)

TE Connectivity Z-PACK HM Series Straight Through Hole Mount PCB Socket, 3-Contact, Solder Termination

60

Available in multiples of 60
60€ 489.60
120€ 979.20
180€ 1,468.80
240€ 1,958.40
300€ 2,448.00
360€ 2,937.60
420€ 3,427.20
480€ 3,916.80
540€ 4,406.40
600€ 4,896.00
660€ 5,385.60
720€ 5,875.20
780€ 6,364.80
840€ 6,854.40
900€ 7,344.00

€ 489.60

€ 8.16 Each (In a Tube of 60) (Exc. VAT)

€ 577.73

€ 9.629 Each (In a Tube of 60) (inc. VAT)

TE Connectivity Z-PACK HM Series Straight Through Hole Mount PCB Socket, 3-Contact, Solder Termination

Stock information temporarily unavailable.

60

Available in multiples of 60
60€ 489.60
120€ 979.20
180€ 1,468.80
240€ 1,958.40
300€ 2,448.00
360€ 2,937.60
420€ 3,427.20
480€ 3,916.80
540€ 4,406.40
600€ 4,896.00
660€ 5,385.60
720€ 5,875.20
780€ 6,364.80
840€ 6,854.40
900€ 7,344.00

Stock information temporarily unavailable.

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more

Technical Document

Specifications

Brand

TE Connectivity

Number Of Contacts

3

Type

Board to Board

Mounting Type

Through Hole

Body Orientation

Straight

Termination Method

Solder

Current Rating

1.15A

Voltage Rating

250 V

Series

Z-PACK HM

Contact Material

Copper

Country of Origin

China

Product details

Z-PACK™ HS3 Connectors

The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more