Technical Document
Specifications
Brand
WinbondMemory Size
128Mbit
Interface Type
Quad-SPI
Package Type
TFBGA
Pin Count
24
Organisation
16M x 8 bit
Mounting Type
Surface Mount
Cell Type
NOR
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Dimensions
8.1 x 6.1 x 0.85mm
Number of Words
16M
Minimum Operating Temperature
-40 °C
Maximum Operating Temperature
+85 °C
Number of Bits per Word
8bit
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P.O.A.
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P.O.A.
5
Technical Document
Specifications
Brand
WinbondMemory Size
128Mbit
Interface Type
Quad-SPI
Package Type
TFBGA
Pin Count
24
Organisation
16M x 8 bit
Mounting Type
Surface Mount
Cell Type
NOR
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Dimensions
8.1 x 6.1 x 0.85mm
Number of Words
16M
Minimum Operating Temperature
-40 °C
Maximum Operating Temperature
+85 °C
Number of Bits per Word
8bit