Thermal Adhesives

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Part Details Brand Type Product Material Package Type Package Size Thermal Conductivity Cure Time Maximum Operating Temperature Minimum Operating Temperature Operating Temperature Range Viscosity Measurement Dielectric Strength Specific Gravity
Fact cure thermally conductive aghesive MG Chemical Thermal Conductive Adhesive Epoxy Syringe 25 ml 0.8W/mK 15 min @ +65 °C, 4 (Room Temperature) h +150°C -40°C -40 → +150 °C 110000 (Part B) cP/s, 72000 (Part A) cP/s 14.8kV/mm 1.71
Medium cure thermally conductive aghesiv MG Chemical Thermal Conductive Adhesive Epoxy Syringe 25 ml 1.1W/mK 2 h @ +65 °C, 24 (Room Temperature) h +150°C -40°C -40 → +150 °C 2000000cP/s 7.3kV/mm 2.23
Slow cure thermally conductive aghesive MG Chemical Thermal Conductive Adhesive Epoxy Syringe 25 ml 1.2W/mK 80 min @ +80 °C +150°C -40°C -40 → +150 °C 700000cP/s 8.5kV/mm 2.2
Fact cure thermally conductive aghesive MG Chemical Thermal Conductive Adhesive Epoxy Cartridge 50 ml 0.8W/mK 15 min @ +65 °C, 4 (Room Temperature) h +150°C -40°C -40 → +150 °C 110000 (Part B) cP/s, 72000 (Part A) cP/s 14.8kV/mm 1.71
Medium cure thermally conductive aghesiv MG Chemical Thermal Conductive Adhesive Epoxy Cartridge 50 ml 1.1W/mK 2 h @ +65 °C, 24 (Room Temperature) h +150°C -40°C -40 → +150 °C 2000000cP/s 7.3kV/mm 2.23
Slow cure thermally conductive aghesive MG Chemical Thermal Conductive Adhesive Epoxy Cartridge 50 ml 1.2W/mK 80 min @ +80 °C +150°C -40°C -40 → +150 °C 700000cP/s 8.5kV/mm 2.2
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