Technical Document
Specifications
Brand
MicrochipFamily Name
MEC170
Package Type
WFBGA
Mounting Type
Surface Mount
Pin Count
144
Device Core
ARM Cortex M4
Data Bus Width
32bit
Program Memory Size
64 kB
Maximum Frequency
33MHz
RAM Size
32 kB
USB Channels
0
Number of SPI Channels
1
Number of CAN Channels
0
Typical Operating Supply Voltage
3 → 3.6 V
Number of USART Channels
0
Number of I2C Channels
1
Number of UART Channels
0
Maximum Number of Ethernet Channels
0
Length
9.15mm
Maximum Operating Temperature
+85 °C
Instruction Set Architecture
ARM v7-M
Dimensions
9.15 x 9.15 x 0.53mm
Width
9.15mm
Height
0.53mm
Number of Ethernet Channels
0
Number of LIN Channels
0
Number of PCI Channels
0
Program Memory Type
SRAM
Minimum Operating Temperature
-40 °C
Country of Origin
United States
P.O.A.
Each (Supplied in a Tray) (Exc. VAT)
Production pack (Tray)
2
P.O.A.
Each (Supplied in a Tray) (Exc. VAT)
Production pack (Tray)
2
Stock information temporarily unavailable.
Please check again later.
Technical Document
Specifications
Brand
MicrochipFamily Name
MEC170
Package Type
WFBGA
Mounting Type
Surface Mount
Pin Count
144
Device Core
ARM Cortex M4
Data Bus Width
32bit
Program Memory Size
64 kB
Maximum Frequency
33MHz
RAM Size
32 kB
USB Channels
0
Number of SPI Channels
1
Number of CAN Channels
0
Typical Operating Supply Voltage
3 → 3.6 V
Number of USART Channels
0
Number of I2C Channels
1
Number of UART Channels
0
Maximum Number of Ethernet Channels
0
Length
9.15mm
Maximum Operating Temperature
+85 °C
Instruction Set Architecture
ARM v7-M
Dimensions
9.15 x 9.15 x 0.53mm
Width
9.15mm
Height
0.53mm
Number of Ethernet Channels
0
Number of LIN Channels
0
Number of PCI Channels
0
Program Memory Type
SRAM
Minimum Operating Temperature
-40 °C
Country of Origin
United States