Technical Document
Specifications
Brand
SemtechDirection Type
Bi-Directional
Diode Configuration
Isolated
Maximum Clamping Voltage
11V
Minimum Breakdown Voltage
6V
Mounting Type
Surface Mount
Package Type
SOIC
Maximum Reverse Stand-off Voltage
5V
Pin Count
8
Peak Pulse Power Dissipation
300W
Maximum Peak Pulse Current
5.1A
ESD protection
Yes
Number of Elements per Chip
4
Minimum Operating Temperature
-55 °C
Dimensions
5 x 4 x 1.5mm
Maximum Operating Temperature
+125 °C
Height
1.5mm
Test Current
1mA
Length
5mm
Width
4mm
Maximum Reverse Leakage Current
20µA
P.O.A.
Standard
1
P.O.A.
Standard
1
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Technical Document
Specifications
Brand
SemtechDirection Type
Bi-Directional
Diode Configuration
Isolated
Maximum Clamping Voltage
11V
Minimum Breakdown Voltage
6V
Mounting Type
Surface Mount
Package Type
SOIC
Maximum Reverse Stand-off Voltage
5V
Pin Count
8
Peak Pulse Power Dissipation
300W
Maximum Peak Pulse Current
5.1A
ESD protection
Yes
Number of Elements per Chip
4
Minimum Operating Temperature
-55 °C
Dimensions
5 x 4 x 1.5mm
Maximum Operating Temperature
+125 °C
Height
1.5mm
Test Current
1mA
Length
5mm
Width
4mm
Maximum Reverse Leakage Current
20µA