Technical Document
Specifications
Brand
STMicroelectronicsDirection Type
Bi-Directional
Maximum Clamping Voltage
100V
Minimum Breakdown Voltage
53.3V
Mounting Type
Surface Mount
Package Type
SMB
Maximum Reverse Stand-off Voltage
48V
Pin Count
2
Peak Pulse Power Dissipation
600W
Maximum Peak Pulse Current
40A
Number of Elements per Chip
1
Minimum Operating Temperature
-55 °C
Dimensions
4.6 x 3.95 x 2.45mm
Maximum Operating Temperature
+150 °C
Maximum Reverse Leakage Current
200nA
Height
2.45mm
Test Current
1mA
Length
4.6mm
Width
3.95mm
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P.O.A.
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P.O.A.
10
Technical Document
Specifications
Brand
STMicroelectronicsDirection Type
Bi-Directional
Maximum Clamping Voltage
100V
Minimum Breakdown Voltage
53.3V
Mounting Type
Surface Mount
Package Type
SMB
Maximum Reverse Stand-off Voltage
48V
Pin Count
2
Peak Pulse Power Dissipation
600W
Maximum Peak Pulse Current
40A
Number of Elements per Chip
1
Minimum Operating Temperature
-55 °C
Dimensions
4.6 x 3.95 x 2.45mm
Maximum Operating Temperature
+150 °C
Maximum Reverse Leakage Current
200nA
Height
2.45mm
Test Current
1mA
Length
4.6mm
Width
3.95mm